High Need for High-Speed Data Transmission Pushing Use of Advanced Photonic Packaging Solutions
ROCKVILLE, MARYLAND, UNITED STATES, July 29, 2024 /
EINPresswire.com/ -- The global
photonic packaging market is estimated to increase from a value of US$ 289 billion in 2024 to US$ 507.87 billion by the end of 2034, says Fact.MR, a market research and competitive intelligence provider, in its recently updated industry report.
Photonic packaging involves the integration of photonic components into systems that are used in sectors such as data centers, healthcare, telecommunications, and consumer electronics. Miniaturization of electronic devices, increasing need for high-speed data transmission components, and advancements in photonic technologies are some of the key factors contributing to overall market growth.
Rising popularity of 5G networks is driving high demand for advanced photonic packaging solutions. This can be attributed to the photonic packaging materials’ ability to handle high-speed data transmission. Miniaturization trend in the electronics sector is augmenting the demand for integrated and compact photonic components. Introduction of automation in assembly and testing processes is enhancing the scalability and reliability of photonic packaging solutions.
Photonic packaging is also widely used in biomedical sensing and imaging technologies. Ever-increasing internet penetration and data usage are further pushing the demand for photonic packaging solutions that can efficiently handle high bandwidths.
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Key Takeaways from Market Study
The global market for photonic packaging is forecasted to expand at a CAGR of 5.8% from 2024 to 2034.The market in the United States is projected to reach US$ 84.08 billion by 2034.Sales of photonic packaging in Japan are calculated to increase at a CAGR of 6.1% through 2034.
Silicon-based photonic packaging is expected to capture 57.3% of the global market share in 2024.Multi-mode photonic packaging solution sales are approximated at US$ 172.53 billion in 2024.
“Advancements in silicon- and gallium-based photonics will generate lucrative opportunities for photonic packaging producers over the coming years,” says a Fact.MR analyst.
Competitive Analysis
Leading companies manufacturing photonic packaging are focused on product innovations, strategic collaborations, and mergers & acquisitions to expand their product offerings and market position.
Photonic packaging will be used in LiDAR systems, augmented reality, and quantum computing in the years ahead. This scope is expected to generate profitable opportunities for key players in the market. Increasing industrial activities in high-potential economies such as Latin America and Asia Pacific are driving expansion opportunities for market players.
• In April 2024, Tyndall’s Photonics Packaging & Systems Integration Group joined hands with MIT to originate sustainable semiconductor chip manufacturing procedures and develop workforce education programs.
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Enhancing Network Architectures for Data Centers
Along with advancing chip technology, data center system topologies may be made considerably more scalable and efficient by extending photonics to the switching nodes. Many data centers are developing novel ideas to release the restrictions on digital functionality and move switching tasks into the optical domain.
High-density integration of silicon photonics with electronics can lead to higher bandwidth per fiber and scalability of the data handled in the switch fabric. Thanks to advancements in silicon photonics manufacturing, a silicon photonic device's optical data capacity can increase as it becomes more commonly employed in data centers. Because of this, data centers are anticipated to see an increase in demand for photonic packaging.
Sophisticated Production Methods Needing Photonic Device Wafer-level Packaging
Wafer-level packaging will replace device-level packaging as a major improvement in packaging in the future. Wafer-level photonic device packaging will gain from advancements and resemble electronic packaging more and more. Better manufacturing process scalability may be achieved with wafer-level packing, which ensures the package's economical viability—especially for mass-market applications. Wafer-level packaging methods will gain traction in the upcoming years as photonics becomes a more popular technological platform for packaging.
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